Glass substrate applications
FT-1 Key Features:1.Increase the adhesion between copper foil and glass
substrate.
2.Can be used as a dielectric layer.
3.Can be used as a buffer layer.
FTG1DC Key Features:1.Circuit Protection.
2.Good copper adhesion.
| Product Number |
Product Style |
Color |
Packaging specifications |
Specification |
Function |
Tensile(kg/cm) |
SR-6000RE FT-1
|
Film tape |
colorless |
One roll is 500mm wide and 25 meters long |
15~45(um) |
Exposable and developable |
≧0.55 |
SR-6000RE FT-1
|
Liquid |
colorless |
One tube of 800cc |
X |
Exposable and developable |
≧0.55 |
| SR-6000RE FTG1DC |
Film tape |
green |
One roll is 500mm wide and 25 meters long |
15~35(um) |
Exposable, developable, solder resist |
|